fib-mill-controller

FIB Mill Controller

Purpose

The FIB Mill Controller skill provides focused ion beam process control for site-specific nanofabrication and sample preparation, enabling precise material removal and deposition at the nanoscale.

Capabilities

• TEM lamella preparation
• Nanoscale milling and deposition
• Pattern writing and editing
• Cross-section imaging
• Gas-assisted etching/deposition
• Damage minimization protocols

Usage Guidelines

FIB Processing

1. TEM Lamella Preparation
2. Deposit protective cap
3. Rough mill with high current
4. Fine polish to target thickness

1. Nanofabrication
2. Define pattern geometry
3. Optimize beam parameters
4. Minimize gallium implantation

1. Circuit Editing
2. Navigate to target location
3. Selective material removal
4. Metal deposition for reconnection

Process Integration

• Nanodevice Integration Process Flow
• Multi-Modal Nanomaterial Characterization Pipeline

Input Schema

{
  "operation": "lamella|milling|deposition|cross_section",
  "material": "string",
  "target_thickness": "number (nm, for lamella)",
  "pattern_file": "string (for milling)",
  "beam_voltage": "number (kV)"
}

Output Schema

{
  "process_parameters": {
    "beam_current": "number (pA)",
    "dwell_time": "number (us)",
    "overlap": "number (%)"
  },
  "milling_depth": "number (nm)",
  "lamella_thickness": "number (nm)",
  "damage_layer": "number (nm)",
  "processing_time": "number (minutes)"
}